NDF04N60Z, NDD04N60Z
N-Channel Power MOSFET
600 V, 2.0 W
Features
? Low ON Resistance
? Low Gate Charge
? ESD Diode ? Protected Gate
? 100% Avalanche Tested
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
ABSOLUTE MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
Parameter Symbol NDF NDD Unit
Drain ? to ? Source Voltage V DSS 600 V
http://onsemi.com
V DSS (@ T Jmax ) R DS(on) (MAX) @ 2 A
650 V 2.0 Ω
N ? Channel
D (2)
Continuous Drain Current R q JC (Note 1)
I D
4.8
4.1
A
Continuous Drain Current R q JC , T A =
100 ° C (Note 1)
Pulsed Drain Current,
V GS @ 10V
I D
I DM
3.0
20
2.6
20
A
A
G (1)
Power Dissipation R q JC
Gate ? to ? Source Voltage
P D
V GS
30
± 30
83
W
V
S (3)
Single Pulse Avalanche Energy, I D = 4.0
A
ESD (HBM) (JESD22 ? A114)
E AS
V esd
120
3000
mJ
V
RMS Isolation Voltage
(t = 0.3 sec., R.H. ≤ 30%, T A = 25 ° C)
(Figure 15)
Peak Diode Recovery (Note 2)
V ISO
dV/dt
4500
4.5
?
V
V/ns
3
3
MOSFET dV/dt
Continuous Source Current
(Body Diode)
Maximum Temperature for Soldering
Leads
Operating Junction and
Storage Temperature Range
dV/dt
I S
T L
T J , T stg
60
4.0
260
? 55 to 150
V/ns
A
° C
° C
1
2
NDF04N60ZG
TO ? 220FP
CASE 221D
4
1
2
NDF04N60ZH
TO ? 220FP
CASE 221AH
3
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Limited by maximum junction temperature
2. I SD = 4.0 A, di/dt ≤ 100 A/ m s, V DD ≤ BV DSS , T J = +150 ° C
1
2
NDD04N60Z ? 1G
IPAK
CASE 369D
4
1 2
3
NDD04N60ZT4G
DPAK
CASE 369AA
ORDERING AND MARKING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2013
June, 2013 ? Rev. 8
1
Publication Order Number:
NDF04N60Z/D
相关PDF资料
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